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          揚杰股份官網主頁
          產品中心
          6寸晶圓
          ESD防護芯片
          ESD防護芯片

          Product status

          Unidirectional/bidirectional

          Channel

          Top Metal

          Back Metal

          Die Size

          Die Size (Width/um)

          Wafer Saw(um)

          Thickness(um)

          Vrwm(V)

          Vbr(V@1mA)

          IR(uA)

          Cj(pf)

          Ipp(A)

          Vcc(V@Ippmax)

          ESD(kV)

          ??
          型號 pdf Unidirectional
          /bidirectional
          Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr(V@1mA) IR(uA) Cj(pf) Ipp(A) Vcc(V@Ippmax) ESD(kV) 產品狀態

          條數據

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